IC Package Packaging Shell Connector

base: milling lead: can be bonded or soldering insulator: electric vacuum glass or ceramic cover plate: can be used in laser welding coating: nickel or gold plated (to meet the requirement of24 hours salt spray) air tightness: leak≤1.0E-3(Pa•cm3)/s Reliability: In line with the requirements of GJB2440 test Notes: Can be customized according to customer's require MODEL: CT-01 A: 13 H: 12.6 N: 6 I: 6.5 MODEL: CT-01 A: 19 H: 14.5 N: 6 I: 7.5 notes: 1all dimensions are in millimeters 2lead size, number and material according to the customer demand can be changed

ELEREVER is a supplier of advanced thermal processing equipment and processes to the alternative energy and electronics assembly markets. ELEREVER equipment and know-how are used in solar cell and fuel cell manufacturing as well as in the production of printed circuit board assemblies and semiconductor packaging. Our main product is sintering furnace, drying furnace, drying kiln, mesh belt furnace, mesh belt kiln and pusher kiln.<p>In 1999 we began on researching and producing fire-resistant material and then we stepped up in thethermal processing equipment business. Our equipment are used in IC heating process, college and institute labs, surface treatment of glasses (such as perfume bottles), pottery production, process of battery production, and other drying by heating processes. In 2007 we got chance to enter the IC package produce business. E-mail or call us today.