High purity metal sputtering target material (3N-6N):
Aluminum target(Al), chromium target(Cr), copper target(Cu), nickel target(Ni), silicon target(Si), germanium target(Ge), niobium target(Nb), titanium target(Ti), indium target(In), silver target(Ag), tin target(Sn), graphite target, tantalum target(Ta), molybdenum target(Mo), gold target(Au), hafnium target(Hf), manganese target(Mn), zirconium target(Zr), magnesium target(Mg), zinc target(Zn), lead target(Pb), iridium target(Ir), yttrium target(Y), cerium target(Ce), lanthanum target(La), ytterbium target(Yb), gadolinium target(Gd), platinum target(Pt), etc..