High Current Carrying Case for IC Shell Packaging

Base: floor and frame structure Lead can be bonded or soldering Insulator: electric vacuum glass or ceramic Cover plate is applicable to parallel welding Coating: nickel- or gold-plated (to meet requirement of 24 hours salt spray) Air tightness: Leak: ≤1.0E-3 (Pa cm3)/s Reliability: inline with requirements of GJB 2440 test Customized requirements are accepted T0254: A: 15.7mm B: 15.7 N: 3mm I: 3.81mmT0257: A: 10.7mm B: 10.7mm N: 3mm I: 2.54mmNotes: Various dimensions are in millimeters Shell height depending on customer's demand Customized lead sizes, numbers and materials are acceptedEach part of this series can be sold separately: T0254 and T0257

ELEREVER is a supplier of advanced thermal processing equipment and processes to the alternative energy and electronics assembly markets. ELEREVER equipment and know-how are used in solar cell and fuel cell manufacturing as well as in the production of printed circuit board assemblies and semiconductor packaging. Our main product is sintering furnace, drying furnace, drying kiln, mesh belt furnace, mesh belt kiln and pusher kiln.<p>In 1999 we began on researching and producing fire-resistant material and then we stepped up in thethermal processing equipment business. Our equipment are used in IC heating process, college and institute labs, surface treatment of glasses (such as perfume bottles), pottery production, process of battery production, and other drying by heating processes. In 2007 we got chance to enter the IC package produce business. E-mail or call us today.